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Chip Packaging Design of Spacemit That Fuses Technology Roots and Futuristic Vision

Chip Packaging Design of Spacemit That Fuses Technology Roots and Futuristic Vision

The overall design draws inspiration from the brand name “SpaceMit” and the product series name “Stone,” embodying the concept of “Returning to the Origin – Moving towards the Future.” It delves into the cultural roots to trace the genesis of technology, wisdom, and civilization from the fundamental material of the chip, symbolizing the fusion of human progress. From basic manufacturing and tool usage, we showcase the evolution towards the chip as the pinnacle of advanced technology and the transmission of wisdom.

Inspired by obsidian, the earliest tool created by humans, the design incorporates elements of cutting, polishing, progress, and iteration. These elements represent the transformation of obsidian into the chip, signifying the advancement of technology and the transmission of knowledge.

In the product packaging design, we have meticulously crafted an irregular faceted appearance, reminiscent of obsidian, tailored to fit the size and shape of the chip. This customization ensures stability and safety during storage and transportation. To provide excellent protection, we have chosen high-strength and wear-resistant materials, such as moderately thick acrylic composites. Moreover, we have incorporated anti-static and shock-absorbing materials to safeguard the chip from potential damage caused by static electricity and mechanical impact.

The transparent design of the packaging shell allows for direct observation of the chip, facilitating display during product launches and enabling customers to appreciate its intricate details. The outer packaging design has been thoughtfully simplified for user convenience, ensuring easy and hassle-free access to the product. Additionally, the folding support of the box cover has been ingeniously designed to create a mini display platform, enhancing the product’s visual appeal and providing a unique showcasing effect.

In the exhibition space design, we continue the hexagonal shape of the chip shell, incorporating the concepts of “Quantum Machines” and “Moving towards the Future.” Through layered lighting effects, we create a captivating display. This design showcases the product’s evolution from the original “Stone” to modern technology, reflecting the brand’s innovation and foresight. It complements the brand name and demonstrates the stability and solidity of the product. Through interactive display areas and virtual reality technology, the audience can gain in-depth understanding of the product’s value and establish a strong connection with the brand.












CREDIT

  • Agency/Creative: Yensu Creativity , Zhiguojun PANG, Shuihua LU , Haifeng JIAO ,
  • Article Title: Chip Packaging Design of Spacemit That Fuses Technology Roots and Futuristic Vision
  • Organisation/Entity: Creative
  • Project Status: Published
  • Agency/Creative Country: China
  • Agency/Creative City: Beijing
  • Keywords: WBDS Creative Design Awards 2024/25

  • Credits:
    CEO of Yensu Creativity: Yue GAO
    Manager of SpaceMit: Sophie Duan

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